Città di Castello, May 14, 2025 – CMC Innovation Day 2025 welcomed over 150 international attendees representing 92 leading eCommerce and logistics companies. The event took place at CMC Packaging Automation’s headquarters in Città di Castello. Its success reaffirmed CMC’s role as a global benchmark in packaging automation.
PACK IT RIGHT: customer experiences and industry insights
This year’s theme, PACK IT RIGHT, guided a day of insights, visionary thinking and innovations in right-sized packaging. During the morning conference, international customers, system integrators and industry leaders shared real-world case studies and emerging market trends.
DHL presented its project with Adidas. Meanwhile, Avantor and Element Logic highlighted their joint project in Germany. They explained the crucial role of integrating CMC Genesys with AutoStore. eMAG, the largest eCommerce player in Eastern Europe, presented its packaging automation project developed with CMC. In addition, Exotec discussed how right-sized packaging complements its new Skypod system.
Live demonstrations and new packaging concepts
In the afternoon, guests visited CMC’s production facility for demonstrations of the full range of on-demand packaging solutions. They also explored two of 2025’s key technological innovations:
- CMC Super Vertical: an ultra-compact machine producing right-sized boxes and mailers for small to mid-sized distribution centers. It is ideal for retrofit projects and maximizing space without compromising productivity.
- New CMC Genesys Concept and Genesys PRIMA: a scalable, modular machine operating as a stand-alone box-first solution or within warehouse workflows. Integration with CMC’s patented Vary-Tote technology enables it to handle irregularly shaped products in advanced pick-to-pack processes.
System integrators from across the globe also attended. They explored the flexibility and scalability of CMC’s solutions for end-to-end project implementations.
Innovation Day expands to Atlanta
Following the event’s success and rising international demand, CMC announced a second edition of CID25. For the first time, Innovation Day will take place at its Tech Centre in Atlanta (USA) on July 16, 2025. The U.S. site already serves as a training hub and testing lab for clients and technology partners. This event will offer an immersive experience to the North American market.
“Integration is no longer optional—it’s essential. At CMC, we believe that innovation must start with listening. Since 1980, we’ve helped companies improve their fulfillment processes and achieve their sustainability goals through high-speed, high-performance technology. In recent years, market demand has shifted: businesses now need scalable solutions that can be deployed in existing, space-constrained environments. This is what has driven our R&D efforts. The result is a new generation of ultra-compact, intelligent systems that can handle a wide variety of items without compromising on package integrity or throughput. With CID25, we wanted to demonstrate that when innovation is driven by vision and passion, there are no limits,” said Francesco Ponti, CMC Executive Chairman and CEO.
Tania Torcolacci, Head of Global Marketing and Strategic Partnerships at CMC, added: “The excitement we received during the event encouraged us to extend Innovation Day to the U.S., where we aim to replicate the energy, dialogue, and value generated here in Italy.”
About CMC Packaging Automation
CMC Packaging Automation is a global leader in right-sized packaging technology. Its sustainable, efficient and innovative solutions are transforming eCommerce fulfilment. Building on a legacy of pioneering automation, CMC continues to shape the future of packaging. Its industry-leading solutions optimize logistics, reduce costs and enhance customer experiences.
Press Contact
Tania Torcolacci
Head of Global Marketing and Strategic Partnerships
tania.torcolacci@cmcsolutions.com
+393357159803
